DEMI 830 - SLA Post Processing

When throughput is essential, the PostProcess DEMI 830™ automated submersion systems are engineered to meet the demands of volume production while ensuring consistency of every part. The DEMI 830 uses our patented Submersed Vortex Cavitation (SVC) technology and removes PolyJet supports or excess resin. PostProcess’ SVC technology utilizes agitated flow to effectively remove supports with a ‘sink-float’ process to rotate parts throughout the chamber. This variable motion, combined with optimal energy delivery and detergent filtration, results in fast and uniform removal. With the motion of fluids within the machine controlled by our Agitation Algorithms, sensor data adjusts in real-time so that parts are not damaged and removal of supports and resin is consistent.

• Increased throughput
  Precision control over temperature and ultrasonic-generated cavitations for accelerated process times.
• Repeatable results
  Submersed Vortex Cavitation technology allows for adjustable flow, reducing the risk of part damage to guarantee intuitive, repeatable results even with complex parts.
• Enhanced safety
  Resin removal chemistry offers a much lower flashpoint and greater longevity compared to IPA and other solvents.
• Optimal sustainability
  Improve sustainability by generating 10x less waste than IPA, using the biocompatible PLM-403-SUB detergent.
• Full software integration
  AUTOMAT3D® digital platform enables full customization and repeatability with one-touch operation.

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